Publication . Costa, Ivo; Pera, David; Silva, José
In this article the optimization of a method to increase the photon capture efficiency of crystalline silicon
(c-Si) wafers is presented. The method is based on metal assisted chemical etching (MACE) using hydrogen
peroxide (H2O2) and hydrofluoric acid (HF) as etchants and silver atoms to catalyze the reaction. Ptype
monocrystalline silicon wafers were used, and different etching times and etchants’ concentrations
were tested. Results proved the capability of MACE to reduce silicon’s effective reflectance to as low as
3.9%. A strong correlation of the etchants’ molar ratio with the obtained structures morphology and
reflectance was also observed.